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1. general description the IP4791CZ12 is designed to protect mobile high-definition multimedia interface (hdmi) transmitter interfaces. it in cludes level shifting for the data display channel (ddc), consumer electronic control (cec), hot plug signal and backdrive protection. in addition, all signals are protected by high-level electrostatic discharge (esd) protection diodes. the level shifting function is required to protect the i/os against overvoltages when the transmitter operates at a supply voltage lowe r than the external devices. the IP4791CZ12 contains active buffers to provide the level sh ifting function, hot pl ug detect input and the cec pull-up current source. the esd protection diodes provide pr otection from esd voltages up to 8 kv, according to iec 61000-4-2, level 4. 2. features and benefits ? hdmi 1.3 compliant ? pb-free, restriction of hazardous substanc es (rohs) compliant and free of halogen and antimony (dark green compliant) ? robust esd protection without degradation after multiple esd strikes ? low leakage even after several hundred esd discharges ? bidirectional level shifting buffer provided for ddc clock and data channels ? backdrive protection ? power management ? cec pull-up current source and level shifting buffer ? hot plug detect module with pull-down resistor ? matched 0.4 mm trace spacing for hdmi type c connector 3. applications the IP4791CZ12 can be used with a range of hdmi transmitter devices including: ? personal computer ? notebook ? mobile phone ? dv camcorder ? digital still camera ? mp3 player IP4791CZ12 hdmi esd protection, level sh ifter and backd rive protection rev. 3 ? 7 january 2011 product data sheet
IP4791CZ12 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 7 january 2011 2 of 17 nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection 4. ordering information 5. functional diagram table 1. ordering information type number package name description version IP4791CZ12 hxson12 plastic, thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 2.1 2.5 0.5 mm sot1156-1 fig 1. functional diagram 001aak735 1.85 k 3.6 k esd rail ddc data (connector) ddc data (system) 5.0 v 5.0 v enable 1.8 v 10 k 26 k esd rail cec out (connector) cec in (system) enable 1.8 v 1.85 k 3.6 k 100 k esd rail ddc clock (connector) ddc clock (system) 5.0 v 5.0 v hdmi_5v0_out hdmi_5v0_in enable 1.8 v esd rail active enable 1.8 v 100 k 5.0 v 100 k esd rail esd rail hot plug in hot plug out 1.8 v 3v3
IP4791CZ12 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 7 january 2011 3 of 17 nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection 6. pinning information 6.1 pinning 6.2 pin description fig 2. pin configuration (transparent top view) 001aak73 4 12 cec_out cec_in 1 11 ddc_clk_out ddc_clk_in 2 10 ddc_dat_out ddc_dat_in 3 9 active v cc_low 4 8 hdmi_5v0_out hdmi_5v0_in 5 7 hotplug_det_in hotplug_det_out 6 gnd table 2. pin description symbol pin description cec_in 1 cec system side ddc_clk_in 2 ddc clock system side ddc_dat_in 3 ddc data system side v cc_low 4 supply voltage, low voltage side for level shifting hdmi_5v0_in 5 5 v line from main supply hotplug_det_out 6 hot pl ug detect system side hotplug_det_in 7 hot plug detect connector side hdmi_5v0_out 8 5 v line to hdmi connector active 9 power saving mode ddc_dat_out 10 ddc data connector side ddc_clk_out 11 ddc clock connector side cec_out 12 cec connector side gnd pad ground
IP4791CZ12 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 7 january 2011 4 of 17 nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection 7. limiting values [1] iec 61000-4-2, level 4, contact discharge. [2] machine model (mm) according to jesd22-a115-a. [3] human body model (hbm) according to jesd22-a-j114d. [4] including the current through the internal pull-up resistors. 8. characteristics table 3. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v esd electrostatic discharge voltage signal pins to ground at hdmi/dvi connector side [1] - 10 kv all pins [2] - 200 v all pins [3] - 2kv v cc supply voltage gnd ? 0.5 5.5 v v i input voltage gnd ? 0.5 5.5 v p tot total power dissipation active = high; ddc operating at 100 khz, 50 % duty cycle; cec operating at 1 khz, 50 % duty cycle [4] -30mw disable: hdmi cable not connected; active = low, ddc bus in idle mode -0.2mw t stg storage temperature ? 55 +125 c t amb ambient temperature ? 40 +85 c table 4. supplies gnd = 0 v; t amb =25 c; unless otherwise specified. symbol parameter conditions min typ max unit v cc(5v0) supply voltage (5.0 v) 4.5 5.0 5.5 v v cc(1v8) supply voltage (1.8 v) 1.62 1.8 3.63 v table 5. static characteristics v cc(5v0) =5.0v; v cc(1v8) = 1.8 v; gnd = 0 v; t amb =25 c; unless otherwise specified. symbol parameter conditions min typ max unit hdmi_5v0_out r dyn dynamic resistance [1] positive transient - 0.6 - negative transient - 0.4 - v cl(ch)trt(pos) positive transient channel clamping voltage v esd = 8 kv, t p =100ns [2] -8.0 -v active v ih high-level input voltage [3] 1.2 - - v v il low-level input voltage - - 0.8 v r pd pull-down resistance 60 100 140 k
IP4791CZ12 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 7 january 2011 5 of 17 nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection ddc buffer - connector side (pin 10 and pin 11) [3] v ih high-level input voltage 0.5 v cc(5v0) -5.5 v v il low-level input voltage ? 0.5 - 0.3 v cc(5v0) v v ik input clamping voltage i i = ? 18 ma - ? 1.0 - v v ol low-level output voltage internal pull-down current - 100 200 mv v oh high-level output voltage [4] v cc(5v0) ? 0.02 - v cc(5v0) +0.02 v c io input/output capacitance v cc(5v0) =0v; v cc(1v8) =0v; v bias =2.5v; ac input = 3.5 v (p-p) ; f = 100 khz [4] - 8 10 pf r pu pull-up resistance 1.6 1.8 2.0 k ddc buffer - system side (pin 2 and pin 3) [3] v ih high-level input voltage 0.26 v cc(1v8) -- v v il low-level input voltage - - 0.20 v cc(1v8) v v ik input clamping voltage i i = ? 18 ma - ? 1.0 - v v ol low-level output voltage - - 0.28 v cc(1v8) v v oh high-level output voltage [4] v cc(1v8) ? 0.02 - v cc(1v8) +0.02 v c io input/output capacitance v cc(5v0) =0v; v cc(1v8) =0v; v bias =2.5v; ac input = 3.5 v (p-p) ; f = 100 khz [4] -68pf r pu pull-up resistance 3.2 3.65 4.1 k cec_out [3] v ih high-level input voltage 2.0 - - v v il low-level input voltage - - 0.80 v v oh high-level output voltage 2.88 3.3 3.63 v v ol low-level output voltage i ol = 1.5 ma - 100 200 mv c io input/output capacitance v cc(5v0) =0v; v cc(1v8) =0v; v bias =2.5v; ac input = 3.5 v (p-p) ; f = 100 khz [4] - 8 10 pf r pu pull-up resistance 23.4 26.0 28.6 k table 5. static characteristics ?continued v cc(5v0) =5.0v; v cc(1v8) = 1.8 v; gnd = 0 v; t amb =25 c; unless otherwise specified. symbol parameter conditions min typ max unit
IP4791CZ12 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 7 january 2011 6 of 17 nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection [1] ansi-esdsp5.5.1-2004, esd sensitivity testing tlp component level method 50 tdr. [2] according to iec 61000, level 4, contact discharge. [3] the device is active if the input volt age at pin active is above the high level. [4] this parameter is guaranteed by design. [1] all dynamic measurements are done with a 50 pf load. ri se times are determined by internal pull-up resistors. cec_in [3] v ih high-level input voltage 0.26 v cc(1v8) -- v v il low-level input voltage - - 0.20 v cc(1v8) v v oh high-level output voltage [4] v cc(1v8) ? 0.02 - v cc(1v8) +0.02 v v ol low-level output voltage - - 0.28 v cc(1v8) v c io input/output capacitance v cc(5v0) =0v; v cc(1v8) =0v; v bias =2.5v; ac input = 3.5 v (p-p) ; f = 100 khz [4] -67pf r pu pull-up resistance 8.5 10.0 11.5 k hotplug_det_in [3] v ih high-level input voltage 2.0 - - v v il low-level input voltage - - 0.8 v r pd pull-down resistance 60 100 140 k c i input capacitance v cc(5v0) =0v; v cc(1v8) =0v; v bias =2.5v; ac input = 3.5 v (p-p) ; f = 100 khz [4] - 8 10 pf hotplug_det_out [3] v oh high-level output voltage i ol =1ma 0.7 v cc(1v8) -- v v ol low-level output voltage i ol = ? 1 ma - 200 300 mv r pd pull-down resistance 60 100 140 k table 5. static characteristics ?continued v cc(5v0) =5.0v; v cc(1v8) = 1.8 v; gnd = 0 v; t amb =25 c; unless otherwise specified. symbol parameter conditions min typ max unit table 6. dynamic characteristics v cc(5v0) =5.0v; v cc(1v8) = 1.8 v; gnd = 0 v; t amb =25 c; unless otherwise specified. symbol parameter conditions min typ max unit ddc_dat_in, ddc_clk_in, ddc_dat_out, ddc_clk_out t plh low to high propagation delay system side to connector side figure 3 [1] -80-ns t phl high to low propagation delay system side to connector side figure 3 [1] -60-ns t plh low to high propagat ion delay connector si de to system side figure 4 [1] -120-ns t phl high to low propagation delay c onnector side to system side figure 4 [1] -80-ns t tlh low to high transition time connector side figure 5 [1] -150-ns t thl high to low transition time connector side figure 5 [1] -100-ns t tlh low to high transition time system side figure 6 [1] -250-ns t thl high to low transition time system side figure 6 [1] -80-ns
IP4791CZ12 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 7 january 2011 7 of 17 nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection 9. ac waveforms 9.1 ddc propagation delay fig 3. propagation delay ddc, ddc sys tem side to ddc connector side fig 4. propagation delay ddc, ddc co nnector side to ddc system side 001aak736 ddc system side ddc connector side v cc(1v8) 0.5 v cc(5v0) 0.28 v cc(1v8) v ol v ol 0.5 v cc(5v0) t phl t plh 0.5 v cc(1v8) v cc(5v0) 001aak737 ddc system side ddc connector side v cc(1v8) 0.5 v cc(5v0) v ol v ol 0.5 v cc(5v0) t phl t plh 0.5 v cc(1v8) 0.5 v cc(1v8) v cc(5v0)
IP4791CZ12 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 7 january 2011 8 of 17 nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection 9.2 ddc transition time fig 5. transition ti me ddc connector side fig 6. transition time ddc system side 001aak73 8 ddc system side ddc connector side v ol v cc(5v0) 80 % v cc(5v0) 20 % v cc(5v0) v cc(1v8) v ol t phl t plh 001aak73 9 ddc system side ddc connector side v cc(1v8) 80 % v cc(1v8) 20 % v cc(1v8) v ol v ol t phl t plh v cc(5v0)
IP4791CZ12 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 7 january 2011 9 of 17 nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection 10. application information 10.1 hdmi source the IP4791CZ12 simplifies the application of a mobile hdmi source. no external components are needed for the application to adapt the hdmi port to the hdmi transmitter. note: the 5 v supply voltage must be in the range 4.8 v to 5.3 v to pass the hdmi compliance test. the active pin is enabling the IP4791CZ12 with a voltage above 1.2 v. connecting the active pin to the hot plug line will enable the IP4791CZ12 automat ically if any hdmi sink is connected to the hdmi port and di sable (switch to power-saving mode of the IP4791CZ12) when no hdmi sink is connecting to the hdmi port. (1) the tdms lines are 100 differential impedance transmiss ion lines which pass underneath the chip without being interrupted by it. fig 7. hdmi transmitter application 001aal76 7 hot plug 1 10 1 9 2 8 (1) (1) 3 7 4 6 d2_p d2_p d2_n d0_p d0_n d1_p d1_n cec_con scl_con sda_con hpd_in active +5 v hdmi clk_p clk_n d2_n d0_p d0_n 5 u1 hdmi-d receptacle ip4283cz10 utility 2 tmds_data 2+ 3 tmds_gnd 4 tmds_data 2 ? 5 tmds_data 1+ 6 tmds_gnd 7 tmds_data 1 ? 8 tmds_data 0+ 9 tmds_gnd 10 tmds_data 0 ? 11 tmds_clk+ 12 tmds_gnd 13 tmds_clk ? 14 cec 15 ddc/cec gnd 16 scl 17 sda 18 p 5v0 19 gnd 20 gnd connector system j1 10 1 9 2 8 3 7 4 6 d1_p d1_n clk_p clk_n cec_sys scl_sys sda_sys 1v8 5v0_in hpd_out 5 u2 ip4283cz10 1 12 2 11 3 10 4 9 5 8 u3 0 IP4791CZ12 6 7
IP4791CZ12 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 7 january 2011 10 of 17 nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection 11. package outline fig 8. package outline sot1156-1 (hxson12) references outline version european projection issue date iec jedec jeita sot1156-1 - - - - - - - - - sot1156-1_po 10-01-21 10-09-17 unit (1) mm max nom min 0.5 0.05 0.00 0.25 0.20 0.15 2.6 2.5 2.4 2.25 2.20 2.15 2.2 2.1 2.0 0.4 2 0.30 0.25 0.20 0.05 a dimensions note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. h xson12: plastic, thermal enhanced extremely thin small outline package; no leads; 1 2 terminals; body 2.1 x 2.5 x 0.5 mm sot1156- 1 a 1 a 3 0.127 bdd h ee h 1.15 1.10 1.05 ee 1 k 0.2 lv 0.1 w 0.05 y 0.05 y 1 0 1 2 mm scale x b a terminal 1 index area d e detail x a a 1 a 3 c y c y 1 b terminal 1 index area e 1 e a c b v c w l e h k d h 6 1 7 12
IP4791CZ12 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 7 january 2011 11 of 17 nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection 12. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 ?surface mount reflow soldering description? . 12.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electr ical circuits. the soldered joint provides both the mechanical and the electrical connection. th ere is no single sold ering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for fine pitch smds. reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 12.2 wave and reflow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased pr obability of bridging. the reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. leaded packages, packages with solder balls, and leadless packages are all reflow solderable. key characteristics in both wave and reflow soldering are: ? board specifications, in cluding the board finish , solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivit y level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 12.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhe sive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath specifications, including temperature and impurities
IP4791CZ12 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 7 january 2011 12 of 17 nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection 12.4 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 9 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature) and coolin g down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 7 and 8 moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 9 . table 7. snpb eutectic process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 < 2.5 235 220 2.5 220 220 table 8. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
IP4791CZ12 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 7 january 2011 13 of 17 nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 13. abbreviations msl: moisture sensitivity level fig 9. temperature profiles for large and small components 001aac84 4 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 9. abbreviations acronym description cec consumer electronic control ddc data display channel dvi digital visual interface esd electrostatic discharge hdmi high-definition multimedia interface rohs restriction of hazardous substances tdms transition minimized differential signalling tdr time domain reflectometer tlp transmission line pulse
IP4791CZ12 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 7 january 2011 14 of 17 nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection 14. revision history table 10. revision history document id release date data sheet status change notice supersedes IP4791CZ12 v.3 20110107 product data sheet - IP4791CZ12 v.2 modifications: ? table 3 ? limiting values ? : p tot maximum value updated. ? table 5 ? static characteristics ? : v ik updated. ? section 10.1 ? hdmi source ? : enhanced. IP4791CZ12 v.2 20101111 preliminary data sheet - IP4791CZ12 v.1 IP4791CZ12 v.1 20100401 objective data sheet - -
IP4791CZ12 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 7 january 2011 15 of 17 nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 15.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 15.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? 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applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
IP4791CZ12 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 7 january 2011 16 of 17 nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 15.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 16. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors IP4791CZ12 hdmi esd protection, level shifter and backdrive protection ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 7 january 2011 document identifier: IP4791CZ12 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 ac waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 7 9.1 ddc propagation delay . . . . . . . . . . . . . . . . . . 7 9.2 ddc transition time . . . . . . . . . . . . . . . . . . . . . 8 10 application information. . . . . . . . . . . . . . . . . . . 9 10.1 hdmi source. . . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 12 soldering of smd packages . . . . . . . . . . . . . . 11 12.1 introduction to soldering . . . . . . . . . . . . . . . . . 11 12.2 wave and reflow soldering . . . . . . . . . . . . . . . 11 12.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11 12.4 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12 13 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 15 legal information. . . . . . . . . . . . . . . . . . . . . . . 15 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 15.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 contact information. . . . . . . . . . . . . . . . . . . . . 16 17 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

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